Platforms & Applications
UMC, Cadence collaborate on 3D-IC hybrid bonding reference flow
United Microelectronics Corporation, a global semiconductor foundry, and Cadence Design Systems, Inc. has announced that Cadence 3D-IC reference flow, featuring the Integrity 3D-IC Platform, has been certified for UMC’s chip stacking technologies, … Continued
Out Now! IoT Now Magazine
IoT Now Magazine Q3 2026
Where your IoT data is processed shapes your latency, cost and compliance. Increasingly, it also decides whether physical AI works once it leaves the lab.
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Semtech debuts KVM software development kit for BlueRiver-based platforms
Semtech Corporation, a high-performance semiconductor, Internet of Things (IoT) systems and Cloud connectivity service provider, has announced the Software Development Kit (SDK) to enable advanced software-based KVM applications using the … Continued
Podcast
Podcast: From Mars to machines: How connectivity powers physical AI in Smart Mobility
Back by popular demand, Trending Tech returns for 2026 with a brand-new episode on one of the year’s hottest topics: physical AI in smart mobility. Explore how physical AI is … Continued
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Polysense debuts iEdge 4.0 OS based configurable, modular BYOD smart IoT terminal
Polysense Technologies Inc., a provider of LPWA IoT solutions for wireless sensing, has announced commercial availability of its next generation iEdge 4.0 OS based smart IoT terminal, which supports the … Continued
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